Finite element analysis of a plate forging considering air-pocketing phenomena
by Bongsu Kim; Jaehun Chung; Sangwook Lee; Jaegun Eom; Mansoo Joun
International Journal of Materials and Product Technology (IJMPT), Vol. 48, No. 1/2/3/4, 2014

Abstract: In this paper, a three-stage plate-forging process is simulated considering air-pockets enclosed by material, dies, or tools and a plane of symmetry. A new basic approach is presented to deal with the air-pocketing phenomena. The volumetric strain of each cavity of an air-pocket is traced when it has no air hole and its pressure, which is a function of the volumetric strain multiplied by the bulk modulus of elasticity of the air-pocket and maximum normal stresses of the neighbouring contact interfaces, is exerted onto the surface of the material inside the air-pocket. This approach is applied to a three-stage plate forging process in which the air-pocketing phenomena can be sensitive to the plastic deformation of the material. The predictions are compared with experimental data and the effect of the bulk modulus of elasticity on the size of air-pocket is evaluated to examine the stability of the present approach.

Online publication date: Fri, 30-May-2014

The full text of this article is only available to individual subscribers or to users at subscribing institutions.

 
Existing subscribers:
Go to Inderscience Online Journals to access the Full Text of this article.

Pay per view:
If you are not a subscriber and you just want to read the full contents of this article, buy online access here.

Complimentary Subscribers, Editors or Members of the Editorial Board of the International Journal of Materials and Product Technology (IJMPT):
Login with your Inderscience username and password:

    Username:        Password:         

Forgotten your password?


Want to subscribe?
A subscription gives you complete access to all articles in the current issue, as well as to all articles in the previous three years (where applicable). See our Orders page to subscribe.

If you still need assistance, please email subs@inderscience.com