Thermal designs for mobile phones cooled with use of phase change material and heat pipe Online publication date: Tue, 30-Sep-2014
by Govindan Radhakrishnan Kumaresh; Fei Duan; Fock-Lai Tan; Chih-Ping Tso
International Journal of Product Development (IJPD), Vol. 18, No. 5, 2013
Abstract: The thermal design on a mobile phone cooling is investigated numerically, using n-eicosane as the Phase Change Material (PCM) stored inside a Heat Storage Unit (HSU). A heat pipe is used inside the phone to transfer heat from various internal heat sources of the phone to the HSU. The chip and casing temperatures of the phone are kept below allowable temperatures through heat absorption by the PCM in the HSU until it is completely melted. Seven different design models of HSU with different fin configurations and different amount of PCM are being investigated. Four different usage conditions are simulated based upon call duration and time interval between calls. Simulation results show an increase in power level reduces the handling time. The light users can use the mobile phone for a longer duration. However, under heavy usage, the PCM gets completely melted much earlier and the handling time is reduced.
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