Investigation of mutual cross-correlation between integrated chip topography modelling and its image features
by Zhongwei Liang; Xiaochu Liu; Bangyan Ye
International Journal of Computational Materials Science and Surface Engineering (IJCMSSE), Vol. 5, No. 2, 2013

Abstract: Since the mutual influence mechanism between IC chip topography modelling and its image features remains unstudied or uncertain, cross-correlation degree has been newly proposed to quantitatively evaluate this objective characteristic to be learned. Through obtaining digital images from IC micro surface and extracting its topography control point cloud, surface fitting in geometrical domain was used to acquire its spatial model. Mutual cross correlation evaluation system was established on this basis as respected. With a series of those calculated cross correlation degrees the mutual influence mechanism and its inherent performance results were quantitatively evaluated between image features and topography surface modelling. By repeatedly experiments the influence disciplines and mutual correlations in different experimental conditions were discussed, which will result to acquirement of final conclusions. This investigation provides valuable technical references and new research ideas for following IC surface topography research with a more effectively mathematical evaluation tool in practice.

Online publication date: Sat, 21-Jun-2014

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