Finite element analysis of creep in a functionally graded rotating disc
by Goel Nitin; Garg Manish; B.S. Saini; V.K. Gupta
International Journal of Computer Aided Engineering and Technology (IJCAET), Vol. 4, No. 5, 2012

Abstract: Creep behaviour of a functionally graded rotating disc has been investigated by using finite element-based Abaqus software. The disc is made of composite containing linear distribution of silicon carbide particles in a matrix of pure aluminium. The creep behaviour of the composite is described by Norton's power law. The creep response of the FGM disc has been estimated by using Abaqus software and compared with a similar disc but having uniform distribution of silicon carbide reinforcement. It is observed that the radial stress in the FGM disc is higher than the uniform composite disc throughout. However, the tangential and effective stresses in the FGM disc show significant increase near the inner radius but exhibit decrease near the outer radius when compared to a uniform composite disc. The strain rates in the FGM disc are significantly lower than those observed in a similar disc having uniform distribution of reinforcement.

Online publication date: Sat, 16-Aug-2014

The full text of this article is only available to individual subscribers or to users at subscribing institutions.

 
Existing subscribers:
Go to Inderscience Online Journals to access the Full Text of this article.

Pay per view:
If you are not a subscriber and you just want to read the full contents of this article, buy online access here.

Complimentary Subscribers, Editors or Members of the Editorial Board of the International Journal of Computer Aided Engineering and Technology (IJCAET):
Login with your Inderscience username and password:

    Username:        Password:         

Forgotten your password?


Want to subscribe?
A subscription gives you complete access to all articles in the current issue, as well as to all articles in the previous three years (where applicable). See our Orders page to subscribe.

If you still need assistance, please email subs@inderscience.com