The effect of atomic density gradient in electromigration
by Yuanxiang Zhang; Yong Liu; Lihua Liang; Xuejun Fan
International Journal of Materials and Structural Integrity (IJMSI), Vol. 6, No. 1, 2012

Abstract: This paper studies the electromigration (EM) failure of interconnect structure and solder joint in a wafer level chip scale package (WL-CSP) based on atomic flux divergence (AFD) method. The impact of atomic density gradient (ADG) on the divergence of the atomic fluxes is investigated. The simulation results show that the traditional AFD method, which neglects the effect of atomic density gradient, can result in significant errors in predicting solder joint failures in a WL-CSP; while the AFD method with the consideration of the atomic density gradient has shown more reasonable results.

Online publication date: Thu, 18-Sep-2014

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