Numerical simulation on the impact resistance of functionally graded materials
by Jiangtao Zhang; Mei Zhang; Pengcheng Zhai; Lisheng Liu; Huiji Shi
International Journal of Materials and Product Technology (IJMPT), Vol. 42, No. 1/2, 2011

Abstract: The stress wave propagation and damage evolution within the sandwich structure of ceramic faceplate/Functionally Graded Materials (FGMs) interlayer/metal backplate are numerically studied in this paper. The microstructure models of FGM interlayer are constructed by introducing a new algorithm based on Voronoi discretisation. Four typical microstructure models of FGM interlayer with different composition gradient are constructed to analyse the effect of composition gradient of FGM interlayer on the stress wave propagation and damage evolution in the sandwich structures under impulse loading. The results demonstrate that the composition gradients of FGM interlayer significantly affect the stress propagation and damage evolution in the sandwich structures. The unidirectivity of stress wave in these models varies with the variation of composition gradient, and a slow variation of composition gradient is helpful for reducing the stress on the surface of backplate.

Online publication date: Sat, 07-Mar-2015

The full text of this article is only available to individual subscribers or to users at subscribing institutions.

 
Existing subscribers:
Go to Inderscience Online Journals to access the Full Text of this article.

Pay per view:
If you are not a subscriber and you just want to read the full contents of this article, buy online access here.

Complimentary Subscribers, Editors or Members of the Editorial Board of the International Journal of Materials and Product Technology (IJMPT):
Login with your Inderscience username and password:

    Username:        Password:         

Forgotten your password?


Want to subscribe?
A subscription gives you complete access to all articles in the current issue, as well as to all articles in the previous three years (where applicable). See our Orders page to subscribe.

If you still need assistance, please email subs@inderscience.com