Failure of flip-chip joints in passive RFID tags and an alternative joining method
by M.S. Islam; Z.Y. Wang
International Journal of Precision Technology (IJPTECH), Vol. 2, No. 4, 2011

Abstract: Natural frequencies of passive radio frequency identification (RFID) tags were studied as they played a great role for their reliability. Both analytical and numerical predictions indicated that natural frequencies were in the kilohertz range; tags must not have been suffered resonance. But in reality, tags used to fail when subjected to low frequency vibrations. Anisotropic conductive adhesive (ACA), a commonly used bonding agent, was detected as the responsible item for these failures. A new bonding method has been put forward that would replace ACA by lead free S-Bond solder material to connect flip chip of an RFID tag to substrate antenna. Having better strength and adhesion characteristics, joints with S-Bond would provide improved bonding as established by analytical and numerical estimation and supported by experimentation.

Online publication date: Sun, 15-Jan-2012

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