Reactive moulding process modelling: structural analysis of thermoset insulated electrical components
by Petri Isotalo, Dariusz Bednarowski, Tomasz Nowak
International Journal of Materials and Product Technology (IJMPT), Vol. 20, No. 4, 2004

Abstract: In this paper, the principles of the developed structural analysis approach for reactive moulding processes are rationalised and described. So far in the industry, the prediction of reactive moulding process induced problems that are directly related to the structural integrity of a finished product have largely been disregarded in the simulations. With the addition of the structural analysis method for reactive moulding processes, the fully three-dimensional simulation approach has been extended to cover all the process stages from mould filling, curing and post-casting heat treatment to final cooling down. The relevant physical phenomena, such as thermal and chemical deformations, that are affecting the structural integrity of analysed castings are taken into account. The utilisation of the structural analysis approach to a medium voltage industrial application case along with selected results is presented later in the paper. The combined effects of numerous variables contributing to the casting process formulate the biggest challenge for reliable analysis results.

Online publication date: Mon, 10-May-2004

The full text of this article is only available to individual subscribers or to users at subscribing institutions.

 
Existing subscribers:
Go to Inderscience Online Journals to access the Full Text of this article.

Pay per view:
If you are not a subscriber and you just want to read the full contents of this article, buy online access here.

Complimentary Subscribers, Editors or Members of the Editorial Board of the International Journal of Materials and Product Technology (IJMPT):
Login with your Inderscience username and password:

Username:        Password:          Forgotten your password?

Want to subscribe?
A subscription gives you complete access to all articles in the current issue, as well as to all articles in the previous three years (where applicable). See our Orders page to subscribe.

If you still need assistance, please email subs@inderscience.com