Investigation of deformation behaviour and abrasive wear mechanism in nanomachining
by Sumaiya Islam, Raafat Ibrahim
International Journal of Surface Science and Engineering (IJSURFSE), Vol. 5, No. 1, 2011

Abstract: The aim of this study is to investigate the deformation behaviour and the abrasive wear mechanism of copper and nickel materials in nanomachining. A nanoindenter equipped with a nanoscratching attachment was used for nanomachining and in situ observation of the machined surfaces. The results showed that the generated normal and cutting forces were higher for Ni than for Cu machining. However, the elastic recovery (%) was lower for Cu than for Ni. Hence, both elastic and plastic deformations were significant in these machining conditions. The pile-up volume due to plastic deformation distinguished between the ploughing and cutting mechanisms. The ploughing mechanism was dominant for Cu machining, while the cutting mechanism was dominant for Ni machining. When the depth of cut was smaller than the cutting tool tip radius, only the ploughing mechanism contributed, otherwise, both mechanisms contributed to produce a nanoscale groove.

Online publication date: Tue, 14-Oct-2014

The full text of this article is only available to individual subscribers or to users at subscribing institutions.

 
Existing subscribers:
Go to Inderscience Online Journals to access the Full Text of this article.

Pay per view:
If you are not a subscriber and you just want to read the full contents of this article, buy online access here.

Complimentary Subscribers, Editors or Members of the Editorial Board of the International Journal of Surface Science and Engineering (IJSURFSE):
Login with your Inderscience username and password:

    Username:        Password:         

Forgotten your password?


Want to subscribe?
A subscription gives you complete access to all articles in the current issue, as well as to all articles in the previous three years (where applicable). See our Orders page to subscribe.

If you still need assistance, please email subs@inderscience.com