Model of reactive sputtering process in deposition of TiAlN coating
by Esmar Budi, Mohd. Razali Bin Muhamad, Saifudin Hafiz Bin Yahaya, Md. Nizam Bin Abdul Rahman
International Journal of Materials Engineering Innovation (IJMATEI), Vol. 2, No. 1, 2011

Abstract: A model of the reactive sputtering process in deposition of TiAlN coating based on the influence of negatively substrate bias (-Vb) on coating composition and deposition rate at various nitrogen flow rate has been developed. TiAlN coatings were deposited by using DC magnetron sputtering. The coating composition and deposition rate were obtained by using SEM/EDX analysis. The results showed that the increase of -Vb decreased the critical nitrogen flow rate (fN2c). The increase of coating composition at nitrogen flow rate lower than fN2c with an increase in -Vb was due to increase of ion flux to the substrate while the decrease of deposition rate was due to coating densification. However, the verification data of coating composition was lower than that of model prediction due to the heterogeneous reaction between sputtered metallic particles and reactive gas at the substrate surface. The experimental results showed that the nitrogen content of unbiased substrate was consistently lower than that of biased substrate and increased with an increase in nitrogen flow rate while the deposition rate was decreased.

Online publication date: Thu, 26-Mar-2015

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