Diffusion bonding of Al₂O₃ with Ti through Ti + TiH₂ interfaces
by Wladyslaw K. Wlosinski
International Journal of Materials and Product Technology (IJMPT), Vol. 10, No. 1/2, 1995

Abstract: The paper gives the results of work on the technological process of the diffusion bonding of Ti with Al₂O₃, using Ti and TiH₂ powder interfaces. These interfaces were applied in the form of powders with a varying percentage content of Ti in relation to TiH₂. Conditions are described under which the process of bonding was taking place, as well as the effect of these conditions on the interface sintering kinetics. The Al₂O₃ to Ti bonds had no cracks and they featured shear-strength higher than 150 MPa. Results are also given of testing the micro-hardness and microstructure of the joints obtained.

Online publication date: Wed, 03-Nov-2010

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