Influence of processing on the development of residual stresses in thick section thermoset composites Online publication date: Wed, 03-Nov-2010
by T. A. Bogetti, J. W. Gillespie
International Journal of Materials and Product Technology (IJMPT), Vol. 9, No. 1/2/3, 1994
Abstract: The design of a cure cycle involves the proper selection of temperature and pressure cycles to allow complete, uniform, controlled cure and sufficient time for ply compaction while completing the cure process in as short a period of time as possible to reduce the cost of producing the part. A major problem encountered in curing thick section laminates is the control of the reaction exotherm and heat transfer in order to achieve uniform cure and, in particular, to minimize residual stresses. The problem is aggravated by the poor and usually non-isotropic thermal conductivity of the assembly. In this work, a cure simulation model is coupled to an incremental laminate plate theory model to investigate the relationship between gradients in temperature, degree of cure, and residual stress. The effects of the autoclave temperature cure cycle and laminate thickness on the evolution of processing induced stress is presented.
Existing subscribers:
Go to Inderscience Online Journals to access the Full Text of this article.
If you are not a subscriber and you just want to read the full contents of this article, buy online access here.Complimentary Subscribers, Editors or Members of the Editorial Board of the International Journal of Materials and Product Technology (IJMPT):
Login with your Inderscience username and password:
Want to subscribe?
A subscription gives you complete access to all articles in the current issue, as well as to all articles in the previous three years (where applicable). See our Orders page to subscribe.
If you still need assistance, please email subs@inderscience.com
Our Blog 
Follow us on Twitter 
Visit us on Facebook