Dynamic properties analysis and test of SMT printed circuit board assembly
by Xianxin Xu, Ping Yang, Haiqing Dong, Yongsheng Wu, Haifeng Xu, Liqiang Zhang, Huang Wang, Xiaoliang Wang
International Journal of Materials and Structural Integrity (IJMSI), Vol. 4, No. 2/3/4, 2010

Abstract: In this paper, a SMT-PCB assembly is manufactured with different packaging forms and material parameters. A finite element model is established for analysing the basic dynamic property of the sample based on some simplified treatments in the modelling. In the meantime, the experimental test is developed to test the dynamic response of the SMT-PCB assembly. The comparison between the experimental test and simulation can illustrate the validity of the test and of the modelling method. It builds a basis for future investigation such as fatigue life estimation and structural optimisation for improving the working characteristics. Finally, some suggestions on how to optimise the chip layout and improve its reliability also are discussed.

Online publication date: Tue, 14-Sep-2010

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