A negative residual stress gradient based micro bridge mechanism for on-chip lifting of micro structures Online publication date: Sun, 25-Apr-2010
by J.S. Chang, S. He
International Journal of Abrasive Technology (IJAT), Vol. 3, No. 2, 2010
Abstract: In this paper, a micro bridge mechanism is presented for on-chip lifting of micro structures. The micro bridge mechanism is made of the thin film with negative residual stress gradient across the thickness. It can be used for constructing vertically moving micro devices or calibrating the residual stress in micro fabricated thin films. The principle of the micro bridge mechanism is explained. An approximation model is developed to estimate the lifting height of the bridge mechanism. Prototypes with various dimensions are fabricated using the MetalMUMPs process and were experimentally measured. Experimental measurements show that even being limited by silicon nitride beams, a lifting height of 30-50 μm has been achieved by the micro bridge mechanism.
Existing subscribers:
Go to Inderscience Online Journals to access the Full Text of this article.
If you are not a subscriber and you just want to read the full contents of this article, buy online access here.Complimentary Subscribers, Editors or Members of the Editorial Board of the International Journal of Abrasive Technology (IJAT):
Login with your Inderscience username and password:
Want to subscribe?
A subscription gives you complete access to all articles in the current issue, as well as to all articles in the previous three years (where applicable). See our Orders page to subscribe.
If you still need assistance, please email subs@inderscience.com