System design and simulation of constant temperature box using semiconductor refrigeration device
by Hui Zhang, Kuang-Chao Fan, Jun Wang
International Journal of Computer Applications in Technology (IJCAT), Vol. 37, No. 2, 2010

Abstract: This paper presents the variation law of temperature in three-dimensional space, which is cooled by the refrigeration provided by the cold side of a semiconductor. The mathematical model of the temperature field of the semiconductor refrigeration device is described, and a numerical study on the temperature profile in a semiconductor refrigeration device was carried out using this model. The problems in the present thermostated containers are discussed, the factor influencing current air organisation and temperature field are analysed. The experimental results show that forced convection is of benefit to the cold transfer and to the rise of refrigeration rate.

Online publication date: Tue, 16-Mar-2010

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