Woven stories: collaboratively authoring microworlds via the Internet
by Tatu Harviainen, Mikko Hassinen, Piet A.M. Kommers, Erkki Sutinen
International Journal of Continuing Engineering Education and Life-Long Learning (IJCEELL), Vol. 9, No. 3/4, 1999

Abstract: Stories as microworlds provide an attractive and open environment for learning. They are easy to combine with almost any subject matter, and students can create them by their own, also in groups. Woven stories are composed of units or text passages called nodes. Thus, they can be represented visually as graphs on a display. Several authors can work on their common woven story simultaneously, by linking different plots together by joining nodes. A preliminary prototype of woven stories was implemented as a web site. Although a simple framework, it reveals the strength of stories as an educational resource and the value of a computer as a technique to enhance the learning process. Moreover, the concept of the woven stories is versatile enough to be applied in various kinds of educational settings. The prototype is available at http://www.cs.Helsinki.fi/group/stories/.

Online publication date: Fri, 11-Dec-2009

The full text of this article is only available to individual subscribers or to users at subscribing institutions.

 
Existing subscribers:
Go to Inderscience Online Journals to access the Full Text of this article.

Pay per view:
If you are not a subscriber and you just want to read the full contents of this article, buy online access here.

Complimentary Subscribers, Editors or Members of the Editorial Board of the International Journal of Continuing Engineering Education and Life-Long Learning (IJCEELL):
Login with your Inderscience username and password:

    Username:        Password:         

Forgotten your password?


Want to subscribe?
A subscription gives you complete access to all articles in the current issue, as well as to all articles in the previous three years (where applicable). See our Orders page to subscribe.

If you still need assistance, please email subs@inderscience.com