A study of the material removal properties in ultrasonic lapping of ZTA ceramics with fixed abrasives by using an online acoustic emission monitoring system
by Bo Zhao, Feng Jiao, Baoyu Du
International Journal of Abrasive Technology (IJAT), Vol. 2, No. 4, 2009

Abstract: In this paper, online acoustic emission (AE) monitoring system was designed to discuss the material removal properties of zirconia toughened alumina (ZTA) ceramics in ultrasonic lapping. By employing a single-point diamond indenter scratching against ZTA workpiece and time frequency analysis of AE signals, the influence of ultrasonic vibration on ductile material removal was studied and it has been clarified that the range of characteristic frequency of material removal of ZTA ceramic is 200 KHz to 250 KHz for ductile mode, 250 KHz to 450 KHz for ductile-brittle mode and 450 KHz to 500 KHz for brittle mode. By wavelet packet analysis, characteristic criterion of material removal for ultrasonic lapping of ZTA ceramics with fixed abrasives was established. Experimental results proved that this criterion can identify whether the process is in ductile removal or brittle removal mode.

Online publication date: Tue, 03-Nov-2009

The full text of this article is only available to individual subscribers or to users at subscribing institutions.

 
Existing subscribers:
Go to Inderscience Online Journals to access the Full Text of this article.

Pay per view:
If you are not a subscriber and you just want to read the full contents of this article, buy online access here.

Complimentary Subscribers, Editors or Members of the Editorial Board of the International Journal of Abrasive Technology (IJAT):
Login with your Inderscience username and password:

    Username:        Password:         

Forgotten your password?


Want to subscribe?
A subscription gives you complete access to all articles in the current issue, as well as to all articles in the previous three years (where applicable). See our Orders page to subscribe.

If you still need assistance, please email subs@inderscience.com