Process modelling and experimentation of a cordless resistance soldering system
by Jun-Tae Lee, Wei Li, Dave (Dae-Wook) Kim
International Journal of Manufacturing Research (IJMR), Vol. 4, No. 4, 2009

Abstract: A direct resistance soldering process is employed to decrease heat losses between the heat conduction interfaces and heat storage. Both conventional and resistance soldering experiments were conducted to investigate the heating rate and efficiencies during the processes. The numerical analysis using a 3-D finite element model shows that the melting time and the temperature of solder is significantly affected by the voltage and thickness of the soldering tips, and the experimental results agree with the simulation results. The direct resistance soldering process of a cordless soldering system is superior to the conventional soldering process in terms of efficiency and heating rate. [Received 19 November 2008; Revised 21 May 2009; Accepted 5 June 2009]

Online publication date: Fri, 18-Sep-2009

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