Production of innovative hemp based three-layered particleboards with reduced raw densities and low formaldehyde emissions Online publication date: Wed, 12-Aug-2009
by Christian Schopper, Alireza Kharazipour, Christian Bohn
International Journal of Materials and Product Technology (IJMPT), Vol. 36, No. 1/2/3/4, 2009
Abstract: The possibility to substitute wood by hemp for the production of wood based panels and the possibility to produce lightweight panels by using hemp are the main research focuses of this project. The regular density of three-layered particleboards (650 kg/m³) shall be decreased to less than 400 kg/m³ by the utilisation of hemp. Another quite interesting aspect that we want to analyse in line with this project is to reduce the formaldehyde emissions of urea-formaldehyde-, melamine formaldehyde- orphenol-formaldehyde-resin bonded wood based panels by using natural binder systems such as proteins and starches.
Existing subscribers:
Go to Inderscience Online Journals to access the Full Text of this article.
If you are not a subscriber and you just want to read the full contents of this article, buy online access here.Complimentary Subscribers, Editors or Members of the Editorial Board of the International Journal of Materials and Product Technology (IJMPT):
Login with your Inderscience username and password:
Want to subscribe?
A subscription gives you complete access to all articles in the current issue, as well as to all articles in the previous three years (where applicable). See our Orders page to subscribe.
If you still need assistance, please email subs@inderscience.com