Embedding of micro thin film sensors into Polycrystalline Cubic Boron Nitride (PCBN) for tooling applications via diffusion bonding
by Dirk Werschmoeller, Xiaochun Li
International Journal of Mechatronics and Manufacturing Systems (IJMMS), Vol. 2, No. 4, 2009

Abstract: The operative range of existing sensors is very limited with respect to withstanding harsh environments (high temperature or pressure, severe strains, etc.). Additionally, available sensors are limited in spatial and temporal resolution due to their large size. This paper reports on design, fabrication and characterisation of embedded sensors for harsh environment application. Using microfabrication techniques along with diffusion bonding, thin film palladium-13wt% chromium micro strain gages were successfully embedded into Polycrystalline Cubic Boron Nitride (PCBN). The proposed sensors were able to withstand the high temperature diffusion bonding process. After embedding, the sensors were still functional and showed good linearity and sensitivity.

Online publication date: Wed, 15-Jul-2009

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