Study on residual resist layer thickness measurement for Nanoimprint Lithography based on near-field optics
by Satoru Takahashi, Shuichi Minamiguchi, Toshiyuki Nakao, Shin Usuki, Kiyoshi Takamasu
International Journal of Surface Science and Engineering (IJSURFSE), Vol. 3, No. 3, 2009

Abstract: To realise Nanoimprint Lithography (NIL) as a highly reliable lithography technique for the next-generation semiconductor fabrication process, it is seriously necessary to measure the thickness of the residual resin layer of several 10 nm remaining between the imprinted patterns and the substrate. In this paper, we propose a novel optical measurement method for the Residual Layer Thickness (RLT) of NIL based on near-field optics, the lateral resolution of which does not depend on the diffraction limit owing to the wavelength. These theoretical and experimental analyses suggest that the proposed method is effective for evaluating the thickness of residual layer of NIL.

Online publication date: Sat, 20-Jun-2009

The full text of this article is only available to individual subscribers or to users at subscribing institutions.

 
Existing subscribers:
Go to Inderscience Online Journals to access the Full Text of this article.

Pay per view:
If you are not a subscriber and you just want to read the full contents of this article, buy online access here.

Complimentary Subscribers, Editors or Members of the Editorial Board of the International Journal of Surface Science and Engineering (IJSURFSE):
Login with your Inderscience username and password:

    Username:        Password:         

Forgotten your password?


Want to subscribe?
A subscription gives you complete access to all articles in the current issue, as well as to all articles in the previous three years (where applicable). See our Orders page to subscribe.

If you still need assistance, please email subs@inderscience.com