Non-invasive monitoring of temperature distribution inside materials with ultrasound inversion method
by Ikuo Ihara, Manabu Takahashi
International Journal of Intelligent Systems Technologies and Applications (IJISTA), Vol. 7, No. 1, 2009

Abstract: A novel ultrasound inversion method for monitoring the temperature distribution inside materials being heated is presented. The method consists of an ultrasonic pulse-echo measurement and a finite difference calculation for determining a 1D temperature distribution. At first, the inversion method has been applied to a numerical model of a heated plate having a temperature gradient to verify the validity of the method. To demonstrate the practicability of the method, a steel plate of 30 mm thickness being heated by contacting with 700°C molten aluminium is evaluated. Ultrasonic pulse-echo measurements are performed for the steel during heating and the inversion method is used to determine the temperature distribution inside the steel. The internal temperature distributions determined by the ultrasound inversion almost agree with those measured using thermocouples installed in the steel.

Online publication date: Tue, 12-May-2009

The full text of this article is only available to individual subscribers or to users at subscribing institutions.

 
Existing subscribers:
Go to Inderscience Online Journals to access the Full Text of this article.

Pay per view:
If you are not a subscriber and you just want to read the full contents of this article, buy online access here.

Complimentary Subscribers, Editors or Members of the Editorial Board of the International Journal of Intelligent Systems Technologies and Applications (IJISTA):
Login with your Inderscience username and password:

    Username:        Password:         

Forgotten your password?


Want to subscribe?
A subscription gives you complete access to all articles in the current issue, as well as to all articles in the previous three years (where applicable). See our Orders page to subscribe.

If you still need assistance, please email subs@inderscience.com