Monocrystalline silicon subjected to multi-asperity sliding: nano-wear mechanisms, subsurface damage and effect of asperity interaction
by W.C.D. Cheong, L.C. Zhang
International Journal of Materials and Product Technology (IJMPT), Vol. 18, No. 4/5/6, 2003

Abstract: Nano-sliding between two surfaces often involves the interaction of many asperities. With the aid of molecular dynamics analysis, this study uses a three-asperity model to investigate the effects of the relative orientation and position of the asperities on the nano-wear mechanism of silicon. It was found that when the first asperity has created a damaged layer, the material would deform differently under subsequent sliding. A thin amorphous layer always remains and there is also an absence of dislocations when the depth of asperity penetration is small. On the other hand, when the asperities are not traversing a damaged zone, the forces experienced by the asperities are independent of their relative positions. The results suggest that the microstructural changes are localised and the initial sliding affects the subsequent deformation over a damaged region.

Online publication date: Sat, 19-Jul-2003

The full text of this article is only available to individual subscribers or to users at subscribing institutions.

 
Existing subscribers:
Go to Inderscience Online Journals to access the Full Text of this article.

Pay per view:
If you are not a subscriber and you just want to read the full contents of this article, buy online access here.

Complimentary Subscribers, Editors or Members of the Editorial Board of the International Journal of Materials and Product Technology (IJMPT):
Login with your Inderscience username and password:

    Username:        Password:         

Forgotten your password?


Want to subscribe?
A subscription gives you complete access to all articles in the current issue, as well as to all articles in the previous three years (where applicable). See our Orders page to subscribe.

If you still need assistance, please email subs@inderscience.com