Computer-aided design for microelectromechanical systems (MEMS)
by Y.C. Lee, B. McCarthy, J. Diao, Z. Zhang, K.F. Harsh
International Journal of Materials and Product Technology (IJMPT), Vol. 18, No. 4/5/6, 2003

Abstract: With the advancements of MEMS foundry services and CAD tools, MEMS devices can be cost-effectively designed and prototyped. Here, four designs that utilise these tools are presented:(1) a flexure design used to reduce the device warpage resulting from the mismatch in thermal expansion coefficients between the device and the substrate for flip-chip bonded MEMS, (2) a digitally positioned micromirror using multiple contacts, (3) a large MEMS flap that achieves uniform movement for fluid mixing, and (4) a 3-dimensional, solder-assembled MEMS device that has been optimised for minimal deviation from the desired assembly angle.

Online publication date: Sat, 19-Jul-2003

The full text of this article is only available to individual subscribers or to users at subscribing institutions.

 
Existing subscribers:
Go to Inderscience Online Journals to access the Full Text of this article.

Pay per view:
If you are not a subscriber and you just want to read the full contents of this article, buy online access here.

Complimentary Subscribers, Editors or Members of the Editorial Board of the International Journal of Materials and Product Technology (IJMPT):
Login with your Inderscience username and password:

Username:        Password:          Forgotten your password?

Want to subscribe?
A subscription gives you complete access to all articles in the current issue, as well as to all articles in the previous three years (where applicable). See our Orders page to subscribe.

If you still need assistance, please email subs@inderscience.com