Atomic simulation for adhesion problem on surfaces of micro gears
by Ningbo Liao, Yang Ping
International Journal of Materials and Product Technology (IJMPT), Vol. 34, No. 3, 2009

Abstract: The next generation of MEMS devices will be so small that the finite element models are pushed to the atomic limit where they fail. In this paper, molecular dynamics simulations for adhesion problem in micro gear train are proposed. A simplified model is presented to simulate surface sliding between metals. The effects of driving forces and temperature on adhesion are analysed. The results show that the adhesion tends to occur between two micro gears after certain cycles and such adhesion accounts for the temperature increase. It is meaningful to prolong the lifetime of micro gear train by selecting proper parameters.

Online publication date: Tue, 14-Apr-2009

The full text of this article is only available to individual subscribers or to users at subscribing institutions.

 
Existing subscribers:
Go to Inderscience Online Journals to access the Full Text of this article.

Pay per view:
If you are not a subscriber and you just want to read the full contents of this article, buy online access here.

Complimentary Subscribers, Editors or Members of the Editorial Board of the International Journal of Materials and Product Technology (IJMPT):
Login with your Inderscience username and password:

Username:        Password:          Forgotten your password?

Want to subscribe?
A subscription gives you complete access to all articles in the current issue, as well as to all articles in the previous three years (where applicable). See our Orders page to subscribe.

If you still need assistance, please email subs@inderscience.com