Microstructure evolution based acceleration factor determination for SnAgCu solder joints during thermal cycling Online publication date: Sat, 21-Jun-2008
by Krishna Tunga, Suresh K. Sitaraman
International Journal of Materials and Structural Integrity (IJMSI), Vol. 2, No. 1/2, 2008
Abstract: The reliability of lead-free solder used in electronic packages during field-use conditions has traditionally been determined using accelerated thermal cycling (ATC) combined with a Norris-Landzberg type acceleration factor. Limited amount of work exists in quantifying the microstructure evolution of lead-free solder during thermal cycling especially during long-term thermal excursions. A phase coarsening based microstructure evolution has been used in the present work to determine the acceleration factor during thermal cycling. Two different plastic ball grid array (PBGA) packages with different sizes and two different lead-free solder alloys, Sn4.0Ag0.5Cu and Sn3.0Ag0.5Cu, were chosen for the study. The acceleration factor can be determined and hence the package can be qualified for field-use conditions in about the same time duration it takes to perform the ATC test.
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