Accelerated aging and thermal-mechanical fatigue modelling of Cu-plated through holes with partial solder filling
by Donald F. Susan, Alice C. Kilgo, Michael K. Neilsen, Paul T. Vianco
International Journal of Materials and Structural Integrity (IJMSI), Vol. 2, No. 1/2, 2008

Abstract: The reliability of connector-to-board solder joints was investigated by accelerated aging experiments and finite element analysis (FEA), with a strain-based criterion for fatigue failure of Cu vias. The accelerated aging temperature cycle was –55°C to +125°C. The pin/through hole solder joints were examined by metallography after test intervals up to 1000 thermal cycles. Partial solder filling of the joints was observed and attributed to Au contamination of the solder and thin solder gaps between the connector pins and Cu-plated vias. All fatigue cracks observed in the vias after thermal cycling were associated with partial solder filling of the joints. The effects of partial solder fill on failure location were confirmed by FEA and acceptable agreement was found between the predicted cycles to failure and the experimentally observed onset of via cracking. The model and experimental results were used to predict component lifetimes for milder thermal-cycle conditions typically found in service.

Online publication date: Sat, 21-Jun-2008

The full text of this article is only available to individual subscribers or to users at subscribing institutions.

 
Existing subscribers:
Go to Inderscience Online Journals to access the Full Text of this article.

Pay per view:
If you are not a subscriber and you just want to read the full contents of this article, buy online access here.

Complimentary Subscribers, Editors or Members of the Editorial Board of the International Journal of Materials and Structural Integrity (IJMSI):
Login with your Inderscience username and password:

Username:        Password:          Forgotten your password?

Want to subscribe?
A subscription gives you complete access to all articles in the current issue, as well as to all articles in the previous three years (where applicable). See our Orders page to subscribe.

If you still need assistance, please email subs@inderscience.com