Dental drilling in severe and demanding environments
by Mark J. Jackson, Htet Sein, Waqar Ahmed, Howard Taylor
International Journal of Nano and Biomaterials (IJNBM), Vol. 1, No. 2, 2007

Abstract: The application of diamond coatings on dental cutting tools has been the subject of attention in order to improve cutting performance and life in orthodontic applications. In order to improve the adhesion between diamond and WC-Co substrates, it is necessary to etch cobalt from the surface and prepare it for subsequent diamond growth. Alternatively, a Titanium Nitride (TiN) interlayer can be used prior to diamond deposition. Diamond film quality and purity was characterised using micro Raman spectroscopy. The performance of diamond coated WC-Co tools, uncoated WC-Co tools and diamond embedded (sintered) tools have been compared by drilling a series of holes into various materials such as human tooth, borosilicate glass and acrylic tooth materials. Flank wear has been used to assess the wear rates of the tools when machining biomedical materials. It is shown that using an interlayer prior to diamond deposition provides the best surface preparation for producing dental tools.

Online publication date: Thu, 10-Jan-2008

The full text of this article is only available to individual subscribers or to users at subscribing institutions.

 
Existing subscribers:
Go to Inderscience Online Journals to access the Full Text of this article.

Pay per view:
If you are not a subscriber and you just want to read the full contents of this article, buy online access here.

Complimentary Subscribers, Editors or Members of the Editorial Board of the International Journal of Nano and Biomaterials (IJNBM):
Login with your Inderscience username and password:

    Username:        Password:         

Forgotten your password?


Want to subscribe?
A subscription gives you complete access to all articles in the current issue, as well as to all articles in the previous three years (where applicable). See our Orders page to subscribe.

If you still need assistance, please email subs@inderscience.com