Effects of kinematic forms on material removal rate and non-uniformity in chemical mechanical planarisation Online publication date: Sun, 02-Dec-2007
by C.L. Wang, Z.J. Jin, R.K. Kang
International Journal of Materials and Product Technology (IJMPT), Vol. 31, No. 1, 2008
Abstract: Chemical Mechanical Polishing (CMP) machine is the main equipment for ultra-precise plane polishing. Based on the Preston equation, the effects of the kinematic form of the carrier and the variables on the material removal rate and the non-uniformity in the main three kinds of chemical mechanical polishers are analysed in this paper. The results may provide a theoretical reference for design of the CMP machine. It is shown that, the kinematic form of the carrier oscillating along the circle arc orbit has a little better uniformity and material removal rate than the other kinematic forms under the same kinematic parameters. In the same kinematic form, with the increase of the slope angle between the locus and the line between the centre of the locus and the centre of the pad, the material removal rates increase and the non-uniformities decrease in the reciprocation mode and the oscillation mode. When the speed of the carrier equals the speed of the pad, the material removal rate and the uniformity is the best.
Existing subscribers:
Go to Inderscience Online Journals to access the Full Text of this article.
If you are not a subscriber and you just want to read the full contents of this article, buy online access here.Complimentary Subscribers, Editors or Members of the Editorial Board of the International Journal of Materials and Product Technology (IJMPT):
Login with your Inderscience username and password:
Want to subscribe?
A subscription gives you complete access to all articles in the current issue, as well as to all articles in the previous three years (where applicable). See our Orders page to subscribe.
If you still need assistance, please email subs@inderscience.com
Our Blog 
Follow us on Twitter 
Visit us on Facebook