Indoor performance analysis of URLLC service for industrial IoT
by Yekta Turk
International Journal of Ad Hoc and Ubiquitous Computing (IJAHUC), Vol. 41, No. 4, 2022

Abstract: The ultra reliable low latency communication (URLLC) service consists of a great opportunity for mobile network operators (MNOs) for the industrial internet-of-things (IIoT) use cases. The URLLC service deployment requires careful considerations, and 100% service availability needs to be the ultimate goal across the factory area. However, it is critical to model the service availability for capacity analysis and observe performance tests for the URLLC service. In this article, the possible deployment scenarios for the URLLC service that can be provided in a factory environment are examined. Besides, a service availability model for URLLC is described. Afterwards, performance testing for realistic deployment scenarios that are based on time division duplex (TDD) is carried out. The results reveal that the framing structure of TDD has a direct impact on the capacity of URLLC, so that framing needs to be selected as a result of a careful site planning process.

Online publication date: Mon, 07-Nov-2022

The full text of this article is only available to individual subscribers or to users at subscribing institutions.

 
Existing subscribers:
Go to Inderscience Online Journals to access the Full Text of this article.

Pay per view:
If you are not a subscriber and you just want to read the full contents of this article, buy online access here.

Complimentary Subscribers, Editors or Members of the Editorial Board of the International Journal of Ad Hoc and Ubiquitous Computing (IJAHUC):
Login with your Inderscience username and password:

    Username:        Password:         

Forgotten your password?


Want to subscribe?
A subscription gives you complete access to all articles in the current issue, as well as to all articles in the previous three years (where applicable). See our Orders page to subscribe.

If you still need assistance, please email subs@inderscience.com