Experimental investigations on the electrodeposition of Ni on copper substrate Online publication date: Mon, 21-Mar-2022
by Aniket Das; Pandu Ranga Vundavilli; B. Surekha; V. Srinivasa Sai
International Journal of Manufacturing Technology and Management (IJMTM), Vol. 35, No. 5, 2021
Abstract: In the present investigation, an attempt is made to study the electrodeposition of nickel (Ni) coatings on the copper substrate. It is important to note that the addition of Ni on the copper surface improves the strength and corrosion resistance by allowing the alloy base substrate remain ductile. In this research, Watt's bath has been used to perform the electrodeposition of Ni layer on copper substrate. During experimentation, the variables, such as current, solution concentration and electroplating time are considered as the input process parameters and metal deposition rate and micro hardness of the coating are treated as the responses. The number of experiments conducted to study the electrodeposition process has been decided based on the central composite design of experiments. It has been observed that the metal deposition rate and micro hardness of the coating are increased with the increase in the operating range of the input process parameters.
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