Metallisation of high density polyurethane surfaces
by Büşra Ünlü; Yahya Öz; Metehan Erdoğan; İshak Karakaya
International Journal of Surface Science and Engineering (IJSURFSE), Vol. 15, No. 3, 2021

Abstract: Electroplating onto polymeric materials is required for different purposes in various applications. Commercial polyurethanes (PU) are electrically insulator materials and durable at high temperatures. Nevertheless, the PU used in this study has a relatively higher electrical conductivity, lower thermal expansion and is a high density foam. In this work, surface metallisation of PU foam was studied to prepare the surface for subsequent electroplating processes. Surface metallisation was carried out by sensitisation, activation and electroless nickel (Ni) plating. Metallised surfaces were characterised according to surface morphologies after electrochemical Ni plating at different current densities and surface preparations. Roughness as well as electrical conductivity of the coatings was investigated. The results show that increasing current density adversely affects the surface morphology and metallisation processes enhance the surface conductivity of the foam.

Online publication date: Fri, 15-Oct-2021

The full text of this article is only available to individual subscribers or to users at subscribing institutions.

 
Existing subscribers:
Go to Inderscience Online Journals to access the Full Text of this article.

Pay per view:
If you are not a subscriber and you just want to read the full contents of this article, buy online access here.

Complimentary Subscribers, Editors or Members of the Editorial Board of the International Journal of Surface Science and Engineering (IJSURFSE):
Login with your Inderscience username and password:

    Username:        Password:         

Forgotten your password?


Want to subscribe?
A subscription gives you complete access to all articles in the current issue, as well as to all articles in the previous three years (where applicable). See our Orders page to subscribe.

If you still need assistance, please email subs@inderscience.com