Investigation of tool-workpiece interaction in nanoscale cutting: a molecular dynamics study Online publication date: Fri, 19-Jul-2019
by Anuj Sharma; Tribeni Roy; Prabhat Ranjan; Debabrata Datta; R. Balasubramaniam
International Journal of Precision Technology (IJPTECH), Vol. 8, No. 2/3/4, 2019
Abstract: Ductile and brittle materials differ in their physical and mechanical properties and pose distinct interaction with the cutting tool while nano-machining. It is thus imperative to analyse the mechanism of material removal and tool-workpiece interaction. Towards this, molecular dynamics simulation (MDS) is carried out to study the diamond tool and workpiece interaction in the nanoscale cutting of Cu (ductile material) and Si (brittle material). Results show that material removal in Cu takes place through shear deformation by dislocations formation and their propagation while in case of Si, it takes place through phase transformation of the material in cutting zone. Force analysis of both the materials shows that machinability of Cu in nanoscale cutting is better compared to Si. Furthermore, tool wear while machining of Si with sharp edge tool is due to chipping whereas radial distribution function reveals that graphitisation of the round edge tool occurs during machining of Si.
Existing subscribers:
Go to Inderscience Online Journals to access the Full Text of this article.
If you are not a subscriber and you just want to read the full contents of this article, buy online access here.Complimentary Subscribers, Editors or Members of the Editorial Board of the International Journal of Precision Technology (IJPTECH):
Login with your Inderscience username and password:
Want to subscribe?
A subscription gives you complete access to all articles in the current issue, as well as to all articles in the previous three years (where applicable). See our Orders page to subscribe.
If you still need assistance, please email subs@inderscience.com
Our Blog 
Follow us on Twitter 
Visit us on Facebook