Grind-hardening of steel surfaces: a focused review
DOI: 10.1504/IJAT.2007.013847 | L.C. Zhang | Surface hardening of steel components using grinding-induced heat seems to be a cost-effective technique for production. This paper provides a review focusing on the research effort on grind-hardening in the author|s Laboratory for Precis... | 3 - 36 |
Characteristics of ductile mode chip formation in nanoscale cutting of brittle materials
DOI: 10.1504/IJAT.2007.013847 | Xiaoping Li, Minbo Cai, Kui Liu, Mustafizur Rahman | In this paper, a comprehensive study of the machining characteristics of nanoscale ductile mode cutting of brittle materials is presented, covering the critical cutting conditions for the ductile mode of chip formation, cutting conditions f... | 37 - 58 |
Application of ice-air jet blasting in treatment of sensitive surfaces
DOI: 10.1504/IJAT.2007.013847 | Krzysztof Kluz, Ernest S. Geskin | Application of water ice particles for precision cleaning was investigated experimentally. Several setups for ice particle generation and blasting were constructed. It was suggested that an efficient technology for formation of particles, i... | 59 - 77 |
Grinding characteristics of engineering ceramics in high speed regime
DOI: 10.1504/IJAT.2007.013847 | Han Huang, Ling Yin | This paper summarises the high speed grinding characteristics of engineering ceramics. The performance in high speed grinding was compared with that of conventional speed grinding. Normal and tangential grinding forces and Acoustic Emission... | 78 - 93 |
Fabrication and evaluation for extremely thin Si wafer
DOI: 10.1504/IJAT.2007.013847 | Libo Zhou, Bahman Soltani Hosseini, Tatsuya Tsuruga, Jun Shimizu, Hiroshi Eda, Sumio Kamiya, Hisao Iwase, Yoshiaki Tashiro | Grinding process on the Si wafer develops subsurface damage, which remarkably degrades deflective strength of the wafer and constitutes a barrier against producing a thin wafer for low-profile packaging. In this paper, the authors propose a... | 94 - 105 |
Design and implementation of an intelligent grinding assistant system
DOI: 10.1504/IJAT.2007.013847 | Michael N. Morgan, Rui Cai, Andrea Guidotti, David R. Allanson, J.L. Moruzzi, W. Brain Rowe | In modern competitive manufacturing industry, machining processes are expected to deliver products with high accuracy and assured surface integrity, using shorter cycle times with reduced operator intervention and increased flexibility. To ... | 106 - 135 |
Electrolytic conditioning of resin-metal-bonded diamond grinding wheels
DOI: 10.1504/IJAT.2007.013847 | Nobuhito Yoshihara, Mingxia Ma, Jiwang Yan, Tsunemoto Kuriyagawa | Recently, high form accuracy and smooth surface are two important requirements in manufacturing of optical parts. It is quite difficult to meet these two demands at the same time. To achieve a high form accuracy, a grinding wheel must have ... | 136 - 142 |
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