The full text of this article
3D topography evolution of micro cracks of subsurface damages during etching process
by Hairong Wang; Cheng Guan; Bike Zhang; Huan Zhang; Guoying Yuan
International Journal of Nanomanufacturing (IJNM), Vol. 9, No. 5/6, 2013
Abstract: To diminish or eliminate surface damage plays an important role in the production of high precision optical components. Characterisation of the 3D topography of subsurface is a useful method to probe into how subsurface damage forms, the effects it brings and the ways to reduce it. In this paper, we got two kinds of K9 glass samples, one with artificial micro cracks on the ground surface and the other one was ground sample. These two samples were etched in differential models and their 3D topographies during etching were recorded and analysed. For the artificial cracks, each single micro crack was opened gradually till it was fully exposed. The etch rate was almost the same along the horizontal direction, but slower at the vertical direction. For the ground sample, the 3D topography during etching was recorded and it shows that the roughness of ground surface increases at first but starts to decrease after it reaches to a high peak value. The 3D topographies of subsurface damage during etching were evaluated and a numerical model to characterise the initial 3D holographic information of cracks was proposed.
Online publication date: Wed, 13-Nov-2013
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