 Topics covered
include
- Statistical/artificial intelligence methods, numerical techniques
- Expert systems, genetic algorithms, neural networks
- Process system design, engineering/materials/technological design
- Mould flow analysis, modelling behaviour of materials
- Materials/engineering databases
- Computer-aided materials selection/design/manufacturing
- Computer-integrated material processing
- Computer-aided learning/teaching
- Casting, powder metallurgy, welding, sintering, plastic deformation
- Heat, thermo-mechanical/chemical treatment
- Thin/thick coatings and other surface treatment methods
- Advanced manufacturing technology, machining, laser/electron beam treatment
- Nanomaterials synthesis, nano/micromanufacturing/technology
- Electronic packaging technology, quality assessment, green manufacturing
- Societal and educational implications
More topics... Methods of analysis and modeling of materials and surfaces:
- Statistical methods
- Artificial intelligence methods
- Expert systems
- Genetic algorithms
- Neural networks
- Numerical techniques
- Process system design
- Mould flow analysis
- Engineering design
- Technological design
- Materials design
- Modelling of behaviour of materials
- Materials and engineering databases
- Computer-aided materials selection
- Computer-aided materials design
- Computer-aided manufacturing
- Computer-integrated material processing
- Computer-aided learning and teaching
Manufacturing and processing of materials: - Casting
- Powder metallurgy
- Welding
- Sintering
- Plastic deformation
- Heat treatment
- Thermo-mechanical treatment
- Thermo-chemical treatment
- Thin and thick coatings and other methods of surface treatment
- Advanced manufacturing technology
- Machining
- Laser treatment
- Electron beam treatment
- Processes for nanomaterials synthesis
- Nanomanufacturing and nanotechnology
- Micromanufacturing
- Electronic packaging technology
- Quality assessment
- Green manufacturing
- Surface engineering
- Societal and educational implications
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ObjectivesThe objective of the IJCMSSE is to establish an effective channel of communication between academic and research institutions and persons concerned with industrial research supported by practical application. It also aims at promoting and coordinating developments in the field of computational materials science and computational surface engineering by publishing original scientific papers which describe computer-aided methods of modelling, simulation and prediction for designing new engineering materials and the technological processes of the manufacturing in materials that are used for solving problems posed by materials and surface engineering professionsals, industrial managers and administrators, and technical education personnel.
ReadershipIJCMSSE is intended for a broad audience such as research professionals, scientists, academics, engineers, policy-makers, managers and students in the field of materials science and engineering, materials processing technologies and surface engineering. ContentsIJCMSSE is a fully refereed, international journal, providing an international forum and an authoritative source of information in the field of computational materials science and surface engineering. It publishes primarily invited original high quality research and review papers, and features progress reports, short communications, technical reports, case studies, management reports, conference reports, and book reviews. IJCMSSE periodically also publishes special issues devoted to developments in important topics including selected scientific conference proceedings. Hide |  Browse issues
Vol. 5
Vol. 4
Vol. 3
Vol. 2
Vol. 1
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 IJCMSSE is listed in:
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Editor in Chief- Han, Qingyou, Purdue University, USA
(hanq purdue.edu)
Associate Editor- Liu, Xiaozhu, Wuhan University of Technology, China
EB Members- Ahmed, Ejaz, BZ University, Pakistan
- Atta-ur-Rahman, Higher Education Commission, Pakistan
- Attia, Helmi, Aerospace Manufacturing Technology Centre, Canada
- Aurich, Jan C., University of Kaiserslautern, Germany
- Azad, Abdul-Majeed, The University of Toledo, USA
- Bououdina, Mohamed, University of Bahrain, Bahrain
- Brown, Christopher A., Worcester Polytechnic Institute, USA
- Butler, David, Nanyang Technological University, Singapore
- Byrne, Gerry, University College Dublin, Ireland
- Carlisle, Keith, Lawrence Livermore National Laboratory, USA
- Chen, Ming, Shanghai Jiao Tong University, China
- Chen, Xun, Liverpool John Moores University, UK
- Cheng, Kai, Brunel University, UK
- Chryssolouris, George, University of Patras, Greece
- Culpepper, Martin L., Massachusetts Institute of Technology, USA
- Efeoglu, Ihsan, Ataturk University, Turkey
- Fang, Fengzhou, Tianjin University, China
- Foord, John, University of Oxford, UK
- Gao, Yongsheng, Hong Kong University of Science and Technology, Hong Kong
- Grácio, José, University of Aveiro, Portugal
- Habib, Sami S., King Abdul Aziz University, Saudi Arabia
- Handy, Rodney G., Purdue University, USA
- Hassan, Israr Ul, Dhofar University, Oman
- Herold, Volker, Friedrich-Schiller-University, Jena, Germany
- Hoffman, Mark, The University of New South Wales, Australia
- Huang, Han, The University of Queensland, Australia
- Hussain, Mohammed Sakhawat, Universiti Teknologi Malaysia, Malaysia
- Jain, V.K., Indian Institute of Technology, India
- Khalid, F. Ahmad, GIK Institute of Engineering Sciences and Technology, Pakistan
- Kim, Sug-Whan, Yonsei University, Republic of Korea
- Kovalenko, Volodymyr S., National Technical University of Ukraine, Ukraine
- Liang, Steven Y., Georgia Institute of Technology, USA
- Liu, Xiongwei, University of Central Lancashire, UK
- Lu, Max, The University of Queensland, Australia
- Luo, Jack, University of Bolton, UK
- Marsh, Eric, The Pennsylvania State University, USA
- Mativenga, Paul, University of Manchester, UK
- Milne, Bill, University of Cambridge, UK
- Moore, John, Colarodo School of Mines, USA
- Ogwu, Abraham Atta, University of the West of Scotland, UK
- Özel, Tugrul, Rutgers University, USA
- Palmer, R.E., The University of Birmingham, UK
- Pei, Z.J., Kansas State University, USA
- Pemble, Martyn E, Tyndall National Institute, Ireland
- Pilkington, Richard, University of Salford, UK
- Sánchez, José A., Escuela Técnica Superior de Ingeniería de Bilbao, Spain
- Sarwar, Mohammed, Northumbria University, UK
- Shah, Mahmood, University of Central Lancashire, UK
- Shih, Albert, University of Michigan, USA
- Srivastava, Anil K., Manufacturing Technology TechSolve, Inc., USA
- Tolfree, David, Technopreneur Ltd, UK
- Tso, Pei-Lum, National Tsing-Hua University, Taiwan
- Uhomoibhi, James, University of Ulster, UK
- Wang, Lihui, KTH Royal Institute of Technology, Sweden
- Webster, Tom, Brown University, USA
- Wen, Dongsheng, Queen Mary University of London, UK
- Xu, Chengying, University of Central Florida, USA
- Yan, Jiwang, Keio University, Japan
- Yilbas, Bekir Sami, King Fahd University of Petroleum and Minerals, Saudi Arabia
- Yin, Ling, James Cook University, Australia
- Zhang, Feihu, Harbin Institute of Technology, China
- Zhang, Liangchi, University of New South Wales, Australia
- Zhao, Qingliang, HIT-Harbin Institute of Technology, China
- Zhong, Zhao Wei, Nanyang Technological University, Singapore
- Zhu, Zhenqi, Stevens Institute of Technology, USA
A few essentials for publishing in this journal
- Submitted articles should not have been previously published or be currently under consideration for publication elsewhere.
- Conference papers may only be submitted if the paper has been completely re-written (taken to mean more than 50%) and the author has cleared any necessary permissions with the copyright owner if it has been previously copyrighted.
- All our articles are refereed through a double-blind process.
- All authors must declare they have read and agreed to the content of the submitted article. A full statement of our Ethical Guidelines for Authors is available.
Submission process
 All articles for this journal must be submitted using our online submissions system.
Read our information on preparing and submitting articles.
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