International Journal of Materials and Product Technology (IJMPT)

International Journal of Materials and Product Technology

2014 Vol.49 No.1

Special Issue on Advances in Electronic Materials and Application

Guest Editors: Professor Xiaofeng Zhao and Professor Bin Li

Editorial

Pages Title and author(s)
5-17Prediction of fatigue life of packaging EMC material based on RBF-SVM
Hai Guo; Jinghua Yin; Jingying Zhao; Zhiyu Huang; Yue Pan
DOI: 10.1504/IJMPT.2014.062934
18-24Design and fabrication of a metal-based asymmetric and variable Y-branch plastic optical fibre coupler
A.A. Ehsan; S. Shaari; M.K. Abd Rahman
DOI: 10.1504/IJMPT.2014.062937
25-40Punch-through and junction breakdown characteristics for uniaxial strained nano-node metal-oxide-semiconductor field-effect transistors on (100) wafers
Mu-Chun Wang; Heng-Sheng Huang; Min-Ru Peng; Shea-Jue Wang; Tsao-Yeh Chen; Wen-Shiang Liao; Hsin-Chia Yang; Chuan-Hsi Liu
DOI: 10.1504/IJMPT.2014.062939
41-56Software architecture and stress tracker utilising nanofibre technique-based smart clothes
Hee-Cheol Kim; Tae-Woong Kim; Mun-Il Joo; Jun-Su Kim; Kayoung Lee; Yao Meng; Sang-Hoon Yi; Gi-Soo Chung
DOI: 10.1504/IJMPT.2014.062940
57-71A study of the nanomachining and nanopatterning on different materials using atomic force microscopy
Jen-Ching Huang; Yung-Jin Weng; Huail-Siang Liu
DOI: 10.1504/IJMPT.2014.062941
72-80Removing the transients electron trapping in P-N junction diode by using soft X-ray annealing method
Surada Ueamanapong; Itsara Srithanachai; Surasak Niemcharoen; Amporn Poyai
DOI: 10.1504/IJMPT.2014.062948