Title: Study on the abrasion mechanism of ultraviolet cured resin bond diamond wheel

Authors: Qiuyun Huang; Lei Guo; Ioan D. Marinescu

Addresses: Department of Mechanical, Industrial and Manufacturing Engineering, The University of Toledo, 1650 N. Westwood Avenue, Toledo, OH, 43606, USA ' Department of Mechanical, Industrial and Manufacturing Engineering, The University of Toledo, 1650 N. Westwood Avenue, Toledo, OH, 43606, USA ' Department of Mechanical, Industrial and Manufacturing Engineering, The University of Toledo, 1650 N. Westwood Avenue, Toledo, OH, 43606, USA

Abstract: Based on an extensive review of traditional machining technologies, a novel method to manufacture abrasive tools using ultraviolet (UV) light curing technique was proposed to achieve the economy and accuracy for machining ceramic materials. The UV cured resin bond tools have been proven to have substantial advantages in machining performance. However, there has been limited research on the abrasion mechanism of such tools. In this paper, the mechanism of such resin bond tools is proposed as a hybrid of conventional grinding and lapping, and called as a grinding/lapping (G/L) process. In order to verify the proposed mechanism, three resin bond diamond wheels cured by UV light were used to conduct lapping, grinding, and G/L process, respectively, under the same experimental set-up. The experimental results like surface roughness (RA) and surface profiles of the workpieces undertaking the three operations were compared and showed good agreement with the proposed mechanism.

Keywords: abrasion mechanisms; ultraviolet; UV curing; resin bond tools; diamond wheels; ceramic materials; ceramics machining; grinding; lapping; surface roughness; workpiece surface profiles; surface quality; diamond grinding wheels.

DOI: 10.1504/IJAT.2016.081337

International Journal of Abrasive Technology, 2016 Vol.7 No.4, pp.257 - 269

Received: 16 Dec 2015
Accepted: 18 Feb 2016

Published online: 05 Jan 2017 *

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