Title: Size effect on heat transfer performance of ZnO/Al₂O₃ interface materials

Authors: Liqiang Zhang; Junchao Li; Chao Wang; Xiaoju Wu; Qiaoya Liu; Chunquan Li

Addresses: Laboratory of Span-Scale Design and Manufacturing for MEMS/NEMS/OEDS, School of Mechanical Engineering, Jiangsu University, Zhenjiang, 212013, China ' Laboratory of Advanced Design, Manufacturing and Reliability for MEMS/NEMS/ODES, School of Mechanical Engineering, Jiangsu University, Zhenjiang, 212013, China ' Laboratory of Advanced Design, Manufacturing and Reliability for MEMS/NEMS/ODES, School of Mechanical Engineering, Jiangsu University, Zhenjiang, 212013, China ' Laboratory of Span-Scale Design and Manufacturing for MEMS/NEMS/OEDS, School of Mechanical Engineering, Jiangsu University, Zhenjiang, 212013, China ' Laboratory of Span-Scale Design and Manufacturing for MEMS/NEMS/OEDS, School of Mechanical Engineering, Jiangsu University, Zhenjiang, 212013, China ' Laboratory of Reliability of Electronic Packaging, School of Mechanical and Electronic Engineering, Guilin University of Electronic Technology, Guilin 541004, China

Abstract: The aim of this paper is to provide a spanscale method to investigate and estimate the interfacial thermal conductivity (ITC) of ZnO/Al₂O₃; interface from the nanoscale to the microscale situation based on the non-equilibrium molecular dynamic (NEMD) method. Comparing the simulated with the experimental data, a fitting model of the ITC from the nanoscale to microscale is built to evaluate its changing rule. The results show that the ITC increased until bulking materials from the nanoscale to microscale. The scope of size effect area reduced to 30 nm from 600 nm and 330 nm comparing with each pure material. It means that the size effect of pure ZnO or Al₂O₃ materials can be avoided by compounding with Al₂O₃ or ZnO materials. It implies a potential method for electronic material design of packaging or micro/nano manufacturing.

Keywords: non-equilibrium molecular dynamics; NEMD; thermal conductivity; size effect; interface materials; ZnO; zinc oxide; Al2O3; alumina; aluminum oxide; heat transfer; simulation; nanotechnology; electronic packaging; materials design; micromanufacturing; nanomanufacturing.

DOI: 10.1504/IJMSI.2015.075828

International Journal of Materials and Structural Integrity, 2015 Vol.9 No.4, pp.228 - 235

Published online: 07 Apr 2016 *

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