Title: Temperature distribution in the workpiece due to electro-discharge diamond surface grinding using FEM

Authors: Vinod Yadava, V.K. Jain, Prakash M. Dixit

Addresses: Mechanical Engineering Department, Motilal Nehru National Institute of Technology, Allahabad, 211 004, India. ' Department of Mechanical Engineering, Indian Institute of Technology, Kanpur, 208 016, India. ' Department of Mechanical Engineering, Indian Institute of Technology, Kanpur, 208 016, India

Abstract: The study of temperature distribution in the workpiece during Electro-Discharge Diamond Surface Grinding (EDDSG) is important from the quality of product point of view. The high temperature generated during machining leads to surface characteristics such as burn marks, microcracks and thermal residual stresses, which are detrimental to the products. Keeping this in view, a numerical thermal model has been developed based on moving heat source for thermal analysis of EDDSG with zero current. A finite element code has been developed and validated by comparing predicted results with the known results from the literature. This paper deals predominantly with the effects of heat flux magnitude, and its distribution (or type), table speed and depth of cut on the top surface temperature distribution of the workpiece during machining of an HSS workpiece. This paper is first of the two parts, which describe the complete thermal analysis of the EDDSG process.

Keywords: electro-discharge diamond surface grinding; EDDSG; finite element method; FEM; hybrid machining process; simulation; temperature distribution; non-traditional machining; advanced machining; workpiece temperature; thermal analysis; heat flux magnitude; electro-discharge abrasive grinding; EDAG; electrical discharge machining; EDM; electro-discharge machining.

DOI: 10.1504/IJMTM.2005.006832

International Journal of Manufacturing Technology and Management, 2005 Vol.7 No.2/3/4, pp.246 - 267

Published online: 17 Apr 2005 *

Full-text access for editors Full-text access for subscribers Purchase this article Comment on this article