Title: Numerical simulation of influence factors of stress distribution of weld-bonded joint under peeling load

Authors: Zhi Li; Min You; Jianping Wang; Gang-yan Li; Li Dong-Ming

Addresses: College of Mechanical and Electronic Engineering, Wuhan University of Technology, Wuhan, Hubei 430070, China; Mechanical Electric Engineering Department, China Three Gorges Project Corporation, Yichang 443002, China ' Hubei Key Laboratory of Hydroelectric Machinery Design & Maintenance, China Three Gorges University, Yichang 443002, China; College of Mechanical and Electronic Engineering, Wuhan University of Technology, Wuhan, Hubei 430070, China ' College of Economics and Management, China Three Gorges University, China ' College of Mechanical and Electronic Engineering, Wuhan University of Technology, Wuhan, Hubei 430070, China ' National Center of Quality Inspection & Testing for Hydraulic Metal Structure Ministry of Water Resources, Zhengzhou 450044, China

Abstract: This paper uses the elastoplastic finite element method to analyse the influence factors of stress distribution of combination effect, including welding point position, and elastic modulus. With the elastic modulus of adhesion increasing, the stress peak value of weld-bonded joints bearing the peeling load will decrease, which makes the stress concentration of welding point more evident. The combination effect of adhesive layer-welding point is mainly relying on the adhesive function between adhesive layer and welding point. If the debonding between adhesive layer and welding point happens, the combination effect will disappear and the adhesive layers hardly bear the load. The stress concentration of welding point is very evident. And the stress peak value of joint will rapidly increase, while the bearing ability and stiffness of weld-bonded joint will decline.

Keywords: peeling load; stress distribution; welding point position; elastic modulus; combination effect; numerical simulation; weld-bonded joints; welding; elastoplastic FEM; finite element method; adhesion; stress peak value; adhesive function; debonding.

DOI: 10.1504/IJCAT.2014.066733

International Journal of Computer Applications in Technology, 2014 Vol.50 No.3/4, pp.232 - 237

Published online: 07 Feb 2015 *

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