Title: Experimental investigation and parametric analysis of electro chemical discharge machining

Authors: Lijo Paul; Somashekhar S. Hiremath; Jinka Ranganayakulu

Addresses: Precision Engineering and Instrumentation Laboratory, Department of Mechanical Engineering, Indian Institute of Technology Madras, Chennai, Tamil Nadu-600036, India ' Precision Engineering and Instrumentation Laboratory, Department of Mechanical Engineering, Indian Institute of Technology Madras, Chennai, Tamil Nadu-600036, India ' Precision Engineering and Instrumentation Laboratory, Department of Mechanical Engineering, Indian Institute of Technology Madras, Chennai, Tamil Nadu-600036, India

Abstract: In today's hi-tech engineering world, a lot of engineering materials are being developed for applications in nuclear industry, automotive industry, aerospace industries, etc. These engineering materials are hard, high strength-to-weight ratio, heat resistant and very difficult to machine using conventional machining techniques. So non-conventional machining techniques gain importance in these fields. Electro chemical discharge machining (ECDM) is one such innovative non-conventional hybrid process, which is used to machine the electrically conductive and non-conductive engineering materials. In present research paper, an innovative study has been made to understand the effect of process parameters of ECDM on material removal rate (MRR) and heat affected zone (HAZ) while machining a silicon wafer. The design of experiments is used for experimental layout plan and for the conduction of experiments. The MRR is found to be non-linear behaviour due to many process parameters like voltage, concentration, duty factor, etc. So response surface modelling (RSM) is used for studying the effect of two parameters simultaneously on MRR. The results are validated with obtained experimental results.

Keywords: electrochemical discharge machining; ECDM; material removal rate; MRR; design of experiments; DOE; response surface methodology; modelling; RSM; heat affected zone; HAZ; silicon wafers; silicon machining; wafer fabrication.

DOI: 10.1504/IJMTM.2014.064628

International Journal of Manufacturing Technology and Management, 2014 Vol.28 No.1/2/3, pp.57 - 79

Received: 13 Apr 2013
Accepted: 06 Feb 2014
Published online: 10 Sep 2014 *

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