Int. J. of Nanomanufacturing   »   2013 Vol.9, No.5/6

 

 

Title: 3D topography evolution of micro cracks of subsurface damages during etching process

 

Authors: Hairong Wang; Cheng Guan; Bike Zhang; Huan Zhang; Guoying Yuan

 

Addresses:
State Key Laboratory for Manufacturing Systems Engineering, Mechanical Engineering, Xi'an Jiaotong University, Xianning Road, 28, Xi'an, Shaanxi Province, China
State Key Laboratory for Manufacturing Systems Engineering, Mechanical Engineering, Xi'an Jiaotong University, Xianning Road, 28, Xi'an, Shaanxi Province, China
State Key Laboratory for Manufacturing Systems Engineering, Mechanical Engineering, Xi'an Jiaotong University, Xianning Road, 28, Xi'an, Shaanxi Province, China
State Key Laboratory for Manufacturing Systems Engineering, Mechanical Engineering, Xi'an Jiaotong University, Xianning Road, 28, Xi'an, Shaanxi Province, China
State Key Laboratory for Manufacturing Systems Engineering, Mechanical Engineering, Xi'an Jiaotong University, Xianning Road, 28, Xi'an, Shaanxi Province, China

 

Abstract: To diminish or eliminate surface damage plays an important role in the production of high precision optical components. Characterisation of the 3D topography of subsurface is a useful method to probe into how subsurface damage forms, the effects it brings and the ways to reduce it. In this paper, we got two kinds of K9 glass samples, one with artificial micro cracks on the ground surface and the other one was ground sample. These two samples were etched in differential models and their 3D topographies during etching were recorded and analysed. For the artificial cracks, each single micro crack was opened gradually till it was fully exposed. The etch rate was almost the same along the horizontal direction, but slower at the vertical direction. For the ground sample, the 3D topography during etching was recorded and it shows that the roughness of ground surface increases at first but starts to decrease after it reaches to a high peak value. The 3D topographies of subsurface damage during etching were evaluated and a numerical model to characterise the initial 3D holographic information of cracks was proposed.

 

Keywords: subsurface damage; SSD; high precision components; nanomanufacturing; 3D topography; micro cracks; holographic information; nanotechnology; optical components; surface roughness.

 

DOI: 10.1504/IJNM.2013.057591

 

Int. J. of Nanomanufacturing, 2013 Vol.9, No.5/6, pp.446 - 456

 

Submission date: 07 Dec 2012
Date of acceptance: 04 Mar 2013
Available online: 13 Nov 2013

 

 

Editors Full text accessAccess for SubscribersPurchase this articleComment on this article