Title: Process modelling and experimentation of a cordless resistance soldering system

Authors: Jun-Tae Lee, Wei Li, Dave (Dae-Wook) Kim

Addresses: Department of Mechanical and Aerospace Engineering, University of California, Davis, CA 95616, USA. ' Department of Mechanical Engineering, University of Washington, Seattle, WA 98195, USA. ' School of Engineering and Computer Science, Washington State University, Vancouver, WA 98686, USA

Abstract: A direct resistance soldering process is employed to decrease heat losses between the heat conduction interfaces and heat storage. Both conventional and resistance soldering experiments were conducted to investigate the heating rate and efficiencies during the processes. The numerical analysis using a 3-D finite element model shows that the melting time and the temperature of solder is significantly affected by the voltage and thickness of the soldering tips, and the experimental results agree with the simulation results. The direct resistance soldering process of a cordless soldering system is superior to the conventional soldering process in terms of efficiency and heating rate. [Received 19 November 2008; Revised 21 May 2009; Accepted 5 June 2009]

Keywords: resistant soldering process; cordless soldering systems; FEM; 3D modelling; process efficiency; finite element method; heat loss; heat storage.

DOI: 10.1504/IJMR.2009.028539

International Journal of Manufacturing Research, 2009 Vol.4 No.4, pp.428 - 438

Published online: 18 Sep 2009 *

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