Modelling of hot compressive deformation behaviour of 55 steel considering strain
by Fan Zeng; Chengliang Hu; Zhen Zhao
International Journal of Materials and Product Technology (IJMPT), Vol. 54, No. 1/2/3, 2017

Abstract: The hot compressive deformation behaviour of 55 steel was investigated using isothermal compression tests in the temperature range of 1,123-1,273 K and a strain rate range of 0.1-10 s−1. Increased deformation temperature and decreased strain rate resulted in a lower flow stress at a given strain. With an increase in strain, most of the flow stresses increased rapidly at first, followed by a fall towards a steady state after a peak stress was reached, which was more significant at higher temperatures and a smaller strain rate. A constitutive model was established based on the Arrhenius equation. Furthermore, the influence of strain was included in the constitutive equation by considering its effect on different material constants. The accuracy of the developed constitutive equations was evaluated using standard statistical parameters. The predicted stress-strain values of 55 steel correlated well with the experimental results.

Online publication date: Wed, 30-Nov-2016

The full text of this article is only available to individual subscribers or to users at subscribing institutions.

 
Existing subscribers:
Go to Inderscience Online Journals to access the Full Text of this article.

Pay per view:
If you are not a subscriber and you just want to read the full contents of this article, buy online access here.

Complimentary Subscribers, Editors or Members of the Editorial Board of the International Journal of Materials and Product Technology (IJMPT):
Login with your Inderscience username and password:

    Username:        Password:         

Forgotten your password?


Want to subscribe?
A subscription gives you complete access to all articles in the current issue, as well as to all articles in the previous three years (where applicable). See our Orders page to subscribe.

If you still need assistance, please email subs@inderscience.com