Effects of interatomic potentials on the determination of the minimum depth of cut in nanomachining Online publication date: Sat, 05-Jul-2014
by A.O. Oluwajobi; X. Chen
International Journal of Abrasive Technology (IJAT), Vol. 6, No. 1, 2013
Abstract: The minimum depth of cut (MDC) is a major limiting factor on achievable accuracy in nanomachining, because the generated surface roughness is primarily attributed to the ploughing process when the uncut chip thickness is less than the MDC. This paper presents the material removal in a nanomachining process, where a sharp diamond tool with an edge radius of few atoms acts on a crystalline copper workpiece. The molecular dynamics (MD) simulation results show the phenomena of rubbing, ploughing and cutting. The formation of chip occurred from the depth of cut thickness of 1~1.5 nm. Also, the effects of the interatomic potentials on the MDC have been presented.
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