Experimental investigation on the surface integrity in machining for Si3N4 engineering ceramics
by Juntao Jing; Hong Zhao; Yunfeng Liu; Xiaoshuang Rao
International Journal of Nanomanufacturing (IJNM), Vol. 9, No. 1, 2013

Abstract: Conventional grinding and rotary ultrasonic grinding machining (RUGM) are applied in precision machining for Si3N4 engineering ceramics mostly. The surface integrity is of great difference with different processing operation. In the paper, the differences of surface integrity by the two machining methods were investigated. The comprehensive evaluation for surface integrity parameters of surface microstructure flaws and mechanical properties was investigated. The surface roughness, surface edge-chipping and surface residual stresses were observed and detected. The experiments results were analysed and discussed based on the material removal process, the motion trail of diamond grits, cutting force and tool wear for the different machining methods. The results show that the surface roughness and the residual stress for RUGM are worse than that for conventional grinding, since the effect of indentation fracture is more notable. However, the scope of edge-chipping is smaller for RUGM than that for conventional grinding due to lower cutting force.

Online publication date: Mon, 31-Mar-2014

The full text of this article is only available to individual subscribers or to users at subscribing institutions.

 
Existing subscribers:
Go to Inderscience Online Journals to access the Full Text of this article.

Pay per view:
If you are not a subscriber and you just want to read the full contents of this article, buy online access here.

Complimentary Subscribers, Editors or Members of the Editorial Board of the International Journal of Nanomanufacturing (IJNM):
Login with your Inderscience username and password:

    Username:        Password:         

Forgotten your password?


Want to subscribe?
A subscription gives you complete access to all articles in the current issue, as well as to all articles in the previous three years (where applicable). See our Orders page to subscribe.

If you still need assistance, please email subs@inderscience.com