Stress distribution in bonded joints: an exploration within a mathematical model
by W.A. Lees
International Journal of Materials and Product Technology (IJMPT), Vol. 2, No. 2, 1987

Abstract: The introduction of 'toughened' adhesives with their enhanced capacity to cope with strain has placed increasing emphasis on the importance of mathematical models to be able to cope with the plastic as well as elastic characteristics of adhesives. The changes in stress distribution caused by a variety of modifications to a collar and pin joint have been explored within the framework of an elastic/plastic model. The results indicate quite clearly how important it is to match the adhesive with the adherends and their proposed geometry.

Online publication date: Sun, 07-Nov-2010

The full text of this article is only available to individual subscribers or to users at subscribing institutions.

 
Existing subscribers:
Go to Inderscience Online Journals to access the Full Text of this article.

Pay per view:
If you are not a subscriber and you just want to read the full contents of this article, buy online access here.

Complimentary Subscribers, Editors or Members of the Editorial Board of the International Journal of Materials and Product Technology (IJMPT):
Login with your Inderscience username and password:

Username:        Password:          Forgotten your password?

Want to subscribe?
A subscription gives you complete access to all articles in the current issue, as well as to all articles in the previous three years (where applicable). See our Orders page to subscribe.

If you still need assistance, please email subs@inderscience.com