Molecular dynamics simulation of effect of grinding wheel stiffness on nanogrinding process
by Jun Shimizu, Libo Zhou, Hiroshi Eda
International Journal of Abrasive Technology (IJAT), Vol. 1, No. 3/4, 2008

Abstract: This paper intends to address an approach of Molecular Dynamics (MD) simulation to clarify the material deformation and removal mechanism between an abrasive grain and workpiece. The workpiece and the abrasive grain are assumed to consist of mono-crystalline copper and rigid diamond, respectively. In the present simulation model, influence of the stiffness of grinding wheel or polishing pad is taken into consideration. From the simulation results, relationships between material removal process and dynamics of the slip deformation, influence of the grinding wheel stiffness on the chip formation process and the actual depth of cut and so on, are clarified. These results indicate that the MD simulation has an advantage in deciding the stiffness of the tools and in estimating the actual depth of cut.

Online publication date: Tue, 30-Sep-2008

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