Modularity in the mediation of market and technology change
by Ron Sanchez
International Journal of Technology Management (IJTM), Vol. 42, No. 4, 2008

Abstract: This paper examines the roles of product and process architectures in mediating market and technological change in a product market. The product and process architectures in use in a product market are defined as the technological platforms for the market. Platforms are then distinguished by whether they are based on integrated or modular architectures, and by whether they are closed systems or open systems in their availability to firms in a product market. Two polar cases – closed-system integrated platforms and open-system modular platforms – are analysed through the five stages of the Product Life Cycle (PLC) model to clarify the significantly different ways in which they enable or constrain the mediation of market and technological change, resulting in distinctive patterns of market evolution. This analysis suggests that the traditional PLC model is not a general model as previously thought, but rather is a special case of market evolution mediated by closed-system integrated platforms. A new model of market evolution – an Open-System Modular Platform Life Cycle (OMPLC) – is proposed to represent the case of a market based on open-system modular platforms.

Online publication date: Thu, 10-Jul-2008

The full text of this article is only available to individual subscribers or to users at subscribing institutions.

 
Existing subscribers:
Go to Inderscience Online Journals to access the Full Text of this article.

Pay per view:
If you are not a subscriber and you just want to read the full contents of this article, buy online access here.

Complimentary Subscribers, Editors or Members of the Editorial Board of the International Journal of Technology Management (IJTM):
Login with your Inderscience username and password:

    Username:        Password:         

Forgotten your password?


Want to subscribe?
A subscription gives you complete access to all articles in the current issue, as well as to all articles in the previous three years (where applicable). See our Orders page to subscribe.

If you still need assistance, please email subs@inderscience.com